Micron: AI firms shell out billions to secure memory years ahead.

High‑bandwidth memory (HBM) is steadily capturing a larger slice of the memory market. Unlike traditional desktop or server RAM, HBM stacks multiple memory dies vertically and positions them in close proximity to AI accelerators, delivering data to GPUs and other AI chips at unprecedented speeds. However, this architectural advantage comes at the cost of more intricate manufacturing and packaging processes.

Micron has announced that its 12‑layer HBM4 memory is now rolling out in high volumes for a key lead customer, while also supplying samples to other industry players. The company reports that HBM4 has already generated over $1 billion in revenue and is scaling twice as fast as its predecessor, HBM3E.

Samsung has cautioned that the memory shortage may persist well into 2027 and beyond. Meanwhile, consumer memory vendors are grappling with steep DDR5 price hikes, indicating that the ripple effects of the shortage are already permeating the broader market.

For the average consumer, this could mean that the AI memory crunch will endure longer than initially anticipated, even as manufacturers pour significant resources into expanding production capacity.